maintenance tools and softwares for mobilephone

Suit for most desoldering of SMD, such as: SOIC、CHIP、QFP、PLCC、BGA, ETC.. ( Applying to the mobile phone flex and flex seat specially solders).

Characteristic：
nbsp; 1、Adopt a nothing to brush wind machine , noise minimal.
nbsp; 2、The linearity adjusts blowing rate , blowing rate is big and air-out is especially gentle.
nbsp; 3、big Power , litre of temperature stabilizes prompt , accurate.
nbsp; 4、Induced handle , real time operation are convenient, environmental protection.
nbsp; 5、Air-out designs , blows revolution to solder plastic, ringing waits for the compon-ent easy to deride not to become deformed , do not foam , not becoming angry.