copper foam for heat exchange,heat dissipation

The technology of producing copper foam by Shanghai Winfay is built on a lace microstructure which improves properties found in standard metal foams. It represents a new lightweight / high performance wick platform that solves some of the most critical thermal management challenges in the electronics sector.Copper Foam are particularly fitted to replace the current copper powder-based wick structures used industry-wide in heat pipes and vapor chambers.

Below is the conventional evaluation of copper foam made by Shanghai Winfay.
Porosity: 5—120 PPI (pores per inch)
Density: 0.15~0.45g/cm3
Cavity: 90%—98%
Element: Cu+Ni, Cu+Al, Cu+Zn
Volume: 600×500×1—100mm

Feature
1. Excellent mechanical property and processability
2. Extraordinary electricity and heat conductivity
3. Massive intricate, lattice-like inner structure
4. The excellent ability of corrosion resistance, superior tensile strength, favorable ductility
5. Magnificent electromagnetic shielding ability.

Special specification are available upon request.