United States Esec 3006 Wire Bonding
Listing ID#10052915
CategorySemiconductors
Semiconductors

United States Esec 3006 Wire Bonding

Specifications

Origin
United States
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Quick answer

United States Esec 3006 Wire Bonding is a Semiconductors product. Key specs — Origin: United States.

Product Description

Specifications: 1998 esec 3006 wire bonder. This machine was used for a prototype application and has very low hours. The condition is very good.

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