Two-component silicone potting gel

Product Name: Two-component silicone potting gel

Product Model: SS-1506

Product Application: SS-1506 is a kind of Low density potting gel with high thermal conductivity that is designed for waterproof, moisture-proof,dustproof,insulation, thermal conductivity,confidentiality,corrosion-resistant, temperature resistance, Shock-proof and other functions of electronic products, such as LED, lithium-ion battery pack Assembly, drive power , automotive HID lamp power module, auto ignition system power supply module and so on.

Product Features: With nice liquidity,single-component glue doesn't curing so it can be stored for a long time. Its curing time can be adjustable under normal temperature after the two components mixed, while its curing time can be shorter under heating conditions.

After Curing, it can maintain rubber elasticity in a wide temperature range (-80~300ºC),and has excellent insulation property for impact-resistant and anti-short circuit. And it also has excellent oxidation resistance and long-term stability to protect electronic products better and improve the service life of electronic products.

Use technology: 1.Weight the two component(1:1) and put them into the mixing tank to stir uniformly (2-5 minute). The error cannot be more than 10%, or it will affect the performance after curing. 2.Pour the mixed compound into the devices within 40 hours.

The vacuum deaeration can be skipped Under normal circumstances .If the High thermal conductivity is required, the vacuum deaeration is advised to do before the pouring. The curing time can be adjusted according to the customer's requirements.

Points for attention: 1.A/B component should be stored hermetically, To avoid waste, the mixed glue should be used up in one time. 2.This product is a non-dangerous goods, but should not be permitted to enter the eyes and mouth.

3.The sediment  is  allowed after the product has been stored for a long time.Please stir it uniformly before use it. 4.The liquid glue will lose its solidification strength when it is exposed to the chemicals below: (1)Organic  compounds  with N,P,S (2)Ionic compounds  with  Sn,Pb,Hg,As and so on (3)Compounds with alkine and vinyl