Tin Sputtering Target
Specifications
- Origin
- china
- Packaging
- vacuum packaging
- Price Term
- EX-Work
- Payment Term
- T/T
Tin Sputtering Target is a Electronic Components, Accessories product. Key specs — Origin: china; Packaging: vacuum packaging; Price Term: EX-Work; Payment Term: T/T.
Product Description
Sputtering Targets Materials list: A,Metal Sputtering Targets: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) B,Alloy Sputtering Targets:AlCu, AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNiCrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr, CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr,WRe,WTi,WCu, ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMg C,Ceramic Sputtering Targets 1,Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2 2,Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC 3,Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3 4,Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN 5,Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO) 6,Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe 7,Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 8,Sulfides Ceramic Sputtering Targets: CuS, Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnS D,Other: AZO,Cr-SiO,CIGS,ITO,IGZO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, Na3AlF6 ,YBCO, LCMO,YSZ