Thermal Paste RJ-723A

Description Composition: Metal Oxide Compounds: 40% Carbon Compounds: 15%~20% Silicone Compounds: 40%~45%

Thermally conductive compound RJ-723A is specially formulated for thermal performance.

Material Properties Property Typical Values Color White Thermal Impedance, 25°C 0.181 C-in /w Dielectric Constant, 100HZ 6 Dielectric Dissipation Factor, 100HZ 0.005 Thermal Conductivity 1.0W/m-k Thixotropic Index, 25°C 320-360 1/10mm Specific Gravity, 25°C 2.3 Oil Separation, 200°C/24Hours ＜0.05% Volatile Content, 200°C/24Hours ＜0.001% Usage Temperature Range -55°C to +200°C

Product Features  Excellent thermal conductivity, good electrical insulation  Good resistance to low and high temperature(-55°C to +200°C)  It will not dry, curing, melt for long-term placement  Non-toxic, odorless, no corrosion  Good spreadability

Applications Some typical uses include:

 CPU chip  Electric iron  Water dispenser  Television  Air conditioner  Power modules  Heat sink  Diode  Triode  Any interface that requires a high performance thermal grease

Recommended Usage Apply a controlled amount of thermally conductive compound RJ-723A to substrate, compress to a thin bond line and properly wet the surface.

Package Available in 500g/can, 1kg/can, 40kg/drum. Syringe Package: 5g, 10g, 20g, 30g. Product quality, Storage and Handling 1.Shelf life: 18 months. 2.The product should be stored at temperature below 30°C. 3.Transported as non-hazardous chemicals.

Notice: Although every effort has been made to ensure that the information contained in this data sheet is reliable, we cannot be held responsible for the correctness of the information or for any loss, injury or damage which may result from its use. Also suggestions of uses should not be taken as inducements to infringe any particular patent.