SMT Adhesive RED GLUE

SMT adhesives are used for fixing of components during wave soldering. Also, in double sided reflow, SMT adhesives help to fix large components. In addition SMT Adhesives can be used for fixing of grid array components e.g. BGA‘s/CSP. This application is also called BGA corner bonding.

Heraeus adhesives are suitable for all common application methods e.g. printing, dispensing, pin transfer and jetting. They are supplied in a big variety of cartridges for all common machines.

Type of Adhesive 1) PD 955 PY PD 955 PRM PD 955 M PD 205A-Jet PD 977 PD 208 PR PD 208 M Application method Stencil printing ++ ++ + ++ Dispensing 2) ++ ++3) + ++ Pin-transfer + Process Very high green strength ++ + + AOI (automatical optic inspection) + + + + + + Lead-free soldering ++ ++ + + + ++ + Good adhesion with difficult-to-glue components ++ ++ ++ + ++ ++ Low temperature curing + Easy cleaning of stencils + + + Recommended for BGA/CSP … corner bonding + ++ Physical properties Halogen-free 4) + + Colour yellow pink red red red orange red 1) The most suitable products for the particular application method are indicated with “++”.

2) For critical glass diodes, PD 860002 SPA is recommended. 3) Recommended for dispensing with Jet-Dispenser (e.g. Asymtek, Mydata) 4) Acc. to IEC 61249-2-21