JUKI KE-2060 SMT part

Operation mode Choose one-round or two-round for the periodic cleaning method.

Cleaning operation Choose whether or not to clean the board-contacting side of the mask.

Interval Set the board printing count that shows the interval of cleaning operation.

Cleaning during a wait of process Choose whether or not to perform the cleaning operation during waiting time, such as while waiting for the next process.

Waiting time Input the waiting time to be elapsed until the cleaning-during-a-wait-of-process starts.

Speed Set the speed of the cleaning operation.

Mode Choose a cleaning mode from either the wet or dry process.

. The wet process must be used exclusively for removing the flux of solder on the mask. The wet process is not available for the backward-cleaning operation.

8. Suction Choose whether or not to enable the suction in cleaning operation, which prevents the mask apertures from being clogged with solder.

. However, when the wet process is chosen, the suction function cannot be performed.

9. Operation Choose whether or not to enable the cleaning operation for forward and backward each.

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. Concepts regarding the mask cleaning

1.5 Creating the Production Data

1 Forward Dry Removes solder balls and flux.

Backward Dry

2 Forward Wet Removes the thin-film-like flux residues.

Backward Dry Removes remaining solvent.

.Solder paste = Solder balls + Flux

Dry cleaning: Removes solder balls and flux (from the apertures and the back of mask). Wet cleaning: Removes the thin-film-like flux residues (from the back of mask).

NOTICE When using the wet cleaning, you are recommended to set it for the “Forward” motion of the second cleaning in two-round cleaning mode. If the wet cleaning is used in one-round cleaning mode, the cleaning performance may be insufficient depending on the type of solder.

. Recommended conditions for mask cleaning

. Cleaning tact time (For the case where board size is 330 × 250)

One-round: About 26 s Two-round: About 50 s