DiamonLaserCuttingMachine

Good quality of Laser beam, small focus spot, narrow cutting gap, high processing speed, smal heat affected zone ; cutting gap is flat smooth, no cracks, high yield; high productivity, close cutting gap, high utilization of silicon area. Automatic delivery discharge, automatic image processing, without manual operation.High cutting speed, high efficiency and precision. Non-contact processing, without supplies, low cost of usage and maintenance costs. The whole process is controlled by computer software, it is easy to operate,and it can give the feedback of abnormal signal . The performance of machine is stable,and it can be used for a long time.

materials applicated and industrial applications

Mainly used for scribing and cutting of diamond, sapphire; it also applies to the scribing and fine processing of thin ceramics, silicon wafers, IC die, the polymer films and other materials.

Specifications

Laser wavelength 532 nm

Beam divergence angle ≤ 2.0mrad

Cutting width 10-30μm

Cutting depth of 10-40μm

Cutting width precision of ± 2μm

Cutting accuracy ± 2μm

Cutting a straight line accuracy of ± 5μm

Cutting straight-line speed 0-300 mm / s

Range of processing 300mm × 300mm

Rated input voltage single-phase AC 220V ± 10%, 50 Hz/60Hz, with protection of ground (such as voltage fluctuation is too large to be equipped with voltage regulator)

Maximum input power 2 kW

Size 1300 mm x 710 mm x 1400 mm

Cooling oil-cooling