DOPO is a Organic Intermediate product. Key specs — Origin: Shandong,China.
Product Description
Chemical Formula: C12H9O2P
Specification:
Item Index
Appearance White crystal or powder
purity ≥99 %
content ≥14.0%
Melting point ≥114℃
packing 25kg/bag
Application: DOPO contains a rigid phosphorus group and thus provide better thermal and flame-retardant properties than the conventional epoxy resins prepared from tetrabromobisphenol A. The advanced epoxy resins are suitable for making a fiber-reinforced epoxy resin composite which is useful in the fabrication of printed circuit boards. The cured epoxy resins can be used in semiconductor encapsulation applications