(Cr) sputtering target is a Metal Processing Services product. Key specs — Origin: BEIJING.
Product Description
is an experter in supplying sputtering targets. We can offers a full line of sputtering targets with various components from industrial grade to super high purity. Mostly targets are manufacture by program. Also we can manufacture targets that are less and rare frequently used compositions.
Also we can offer some addition server include substrade, bond insisted on improving our fabrication techniques for supply more values and better products.Sputtering targets fabrication methods: Vacuum Induction Melting (VIM), Vacuum induced levitation melting furnace Vacuum Sintering, Vacuum Melting Casting, Vacuum Arc Melting, Hot Pressing (HP), Hot Isostatic Pressing (HIP), Cold Isostatic Pressing(CIP)......
Now our plasma spray technique is studying and improveing, we will can offer some target sample.
Sputtering Targets Shape and Size: Discs, Rectangle, Step, Plates, Sheets, Tube, Foils, Rods, Taper, Ring, S-Guns, targets, column targets, step wafer targets (Dia1mm ) Rectangle Targets, Slice Targets, Step Rectangle Targets (Longth 2mm) Sputter Coating Application: Sputter coating thin film primary be used field include decorate thin film, construction glass, automobile widow, low radiation glass, plane display, optical communication/ optics field, light date store field, magnetism date store field..
Backing Plates and Bonding Service: Backing plate include OFHC copper, Aluminum, Titanium, Stainless steel or Molybdenum. The dimension will base on your drawing and you design.
Bonding Service º Back metallisation up to 1600 x 1000mmº Metallic and non-metallic bond coverage >98%º Ultrasonic c-scan on bond integritySubstrate Wafer, We offer a complete line substrate with good surface.
Sputtering Targets Materials list: Metal sputtering target: Aluminum (Al),Antimony (Sb), Bismuth (Bi), Boron (B), Cadmium (Cd), Cerium (Ce), Chromium (Cr), Cobalt (Co), Copper ( Cu), Dysprosium (Dy), Erbium (Er), Europium (Eu), Gadolinium (Gd), Germanium (Ge), Gold (Au), Graphite, Carbon, (C), Hafnium (Hf), Holmium (Ho), Iridium (Ir), Indium (In), Iron (Fe), lanthanum (La), Lead (Pb), Lutetium (Lu), Manganee (Mn), Molybdenum (Mo), Magnesium (Mg),Neodymium (Nd), Niobiums (Nb), Nickel (Ni), Palladium (Pd),Platinum (Pt), Praseodymium (Pr),Rhenium (Re), Ruthenium (Ru), Samarium (Sm), Scandium (Sc),Selenium (Se), Silicon (Si), Silver (Ag), Tantalum (Ta), Terbium (Tb), Tellurium (Te),Tin (Sn), Thulium (Tm), Titanium (Ti), Tungsten (W), Vanadium (V), Ytterbium (Yb), Yttrium (Y), Zirconium (Zr), Zinc (Zn) Alloy Sputtering Targets:AlCu,AlCr,AlMg,AlSi,AlSiCu,AlAg,AlV,CaNiCrFe, CaNi, CrFeMoMn, CeGd, CeSm, CrSi, CoCr,CoCrMo, CoFe, CoFeB ,CoNi, CoNiCr, CoPt,CoNbZr,CoTaZr, CoZr,CrV,CrB, CrSi, CrCu, CuCo, CuGa, CuIn, CuNi, CoNiPt, CuZr,DyFe, DyFeCo, FeB,FeC, FeMn, GdFe, GdFeCo, HfFe, IrMn, IrRe, InSn, MoSi, NiAl, NiCr, NiCrSi, NdDyFeCo, NiFe, NiMn, NiNbTi,NiTi,NiV,SmCo,AgCu, AgSn,TaAl,TbDyFe,TbFe,TbFeCo, TbGdFeCo, TiAl, TiNi, TiCr,WRe,WTi,WCu, ZrAl,ZrCu,ZrFe,ZrNb,ZrNi,ZrTi,ZrY,ZnAl,ZnMgCeramic sputtering target: Boride Ceramic Sputtering Targets: Cr2B, CrB, CrB2, Cr5B3, FeB, HfB2 ,LaB6, Mo2B, Mo2B5 ,NbB, NbB2, TaB, TaB2, TiB2, W2B, WB, VB, VB2, ZrB2Carbide Ceramic Sputtering Targets : B4C,Cr3C2,HfC,Mo2C,NbC,SiC,TaC, TiC, WC, W2C, VC, ZrC Fluoride Ceramic Sputtering Targets : AlF3, BaF3, CdF2, CaF2, CeF3, DyF3, ErF3, HfF4, KF, LaF3, PbF2, LiF, PrF3, MgF2, NdF3, ReF3, SmF3, NaF, Cryolite, Na3AlF6 , SrF2, ThF4, YF3, YbF3Nitrides Ceramic Sputtering Targets :AlN, BN,GaN, HfN, NbN, Si3N4, TaN, TiN, VN, ZrN Oxide Ceramic Sputtering targets: Al2O3, Sb2O3, ATO ,BaTiO3, Bi2O3, CeO2, CuO, Cr2O3 ,Dy2O3 ,Er2O3, Eu2O3, Gd2O3, Ga2O3, GeO2, HfO2, Ho2O3, In2O3, ITO, Fe2O3, Fe3O4, La2O3, PbTiO3, PbZrO3, LiNbO3, Lu3Fe5O12, Lu2O3, MgO, MoO3, Nd2O3, Pr6O11, Pr(TiO2)2, Pr2O3, Sm2O3, Sc2O3, SiO2, SiO, SrTiO3, SrZrO3, Ta2O5, Tb4O7, TeO2, ThO2, Tm2O3, TiO2, TiO, Ti3O5, Ti2O3, SnO2, SnO, WO3, V2O5, YAG, Y3Al5O12, Yb2O3, Y2O3, ZnO, ZnO:Al, ZrO2(unstabilized), ZrO2-5-15wt%CaO)Selenides Ceramic Sputtering Targets: Bi2Se3, CdSe, In2Se3, PbSe, MoSe2, NbSe2, TaSe2, WSe2, ZnSe Silicides Ceramic Sputtering Targets: Cr3Si, CrSi2, CoSi2, HfSi2, MoSi2, NbSi2, TaSi2, Ta5Si3, TiSi2, Ti5Si3, WSi2, V3Si, VSi2, ZrSi2 Sulfides Ceramic Sputtering Targets: Sb2S3, As2S3, CdS, FeS, PbS, MoS2, NbS1.75, TaS2, WS2, ZnSTellurides Ceramic Sputtering Targets: PbTe, MoTe2, NbTe2, TaTe2, WTe2, ZnTeOther: Cr-SiO, GaAs, Ga-P, In-Sb, InAs, InP, InSn, LSMO, YBCO, LCMO