COG bonding machine for IC etc

bonding machines COG bondingmachine bonder machine

COG bonding machine for IC etc

COG bonding machine XCG93-C1

bonding machines

bonding machine

COG bonding machines

COG bonder machine

COG bonder machines

1.About the application field of COG bonding machine XCG93-C1(the pressure).

COG bonding equipment (the pressure) is widely used in a variety of LCD display (LCD), modules (LCM) and large-sized display panel production, assembly, maintenance, production enterprises; such as. mobile phones, laptops, LCD monitors, tablet PCs, LCD / LCM production, assembly, repair enterprises.

2.Basic parameters of XCQ77-A1

Input Power. AC220V 50-60HZ

Vacuum control. vacuum + vacuum generator

Dimensions. L1000 * W1050 * H1475mm (excluding warning lights)

Operating modes. 7-inch HMI

Control system (LG-LS). a programmable processor

Pressure gauge. KITA, the number of explicit

Pressure regulator. Japan SMC, precision pressure regulating valve

Pressure accuracy. ± 0.5% full in the degree

Sensitivity. 0.2% full in the degree

Pressure Unit. Kg / N / Mpa / Kpa swap

counterpoint mode. CCD next counterpoint

Platform Work. Fixed

Platform Material. high quality Bakelite

Heating. heating thermostat

Thermocouple. K type

Blade material. 440C

Temperature range. RT-500

3.About the functions and characteristics of COG bonding machine XCG93-C1(the pressure).

3.1 heating curve with digital temperature display synchronization.

3.2 can store 500 groups of function parameters.

3.3 thermocouple output parameters can be adjusted according to the head power.

3.4 SUNSOM twin eliminate structural weight, pressure accurate.