1A1 Parallel Grinding Wheel

Products Introduction Resin binder having a good self-sharpening, sharp cutting, high grinding efficiency, workpiece surface roughness is low, less heat, easy to burn the workpiece, suitable for most workpiece materials efficiency, precision grinding and polishing.

The main target: the industry for LED sapphire wafer, the silicon wafer, GaAs, GaN wafer, glass and other products processing industry.

Material of workpiece: synthetic sapphire, Monocrystalline silicon, gallium arsenide and gallium nitride and other materials Juchuang Abrasive offers a variety of resin bonded grinding wheel, Diameter range: φ6-900mm, wheel thickness: 0.5-400mm, grit size: 30/35-w0.5, offer the special wheels as customer’s requirements.