Semiconductor Parameter Analyzer - HP 4062

HP 4062 Semiconductor Parameter Analyzer from Allwin21 Corp

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HP 4062UX
Displayed information--measurement setups, auto-sequence pro-
grams, measurement results--can be dumped directly onto an ex-
ternal graphics plotter to obtain publication-quality hard copies. A
built-in 3-~-inch disk drive enables you to store measurement setups
and measured data, which can be accessed by another compatible HP
disk drive for further processing.
Auto Sequence Programs
Measurement programs stored on a HP 4145B 3~-inch disk can be
linked by an auto-sequence program, making it possible to perform a
series of measurements with just one keystroke.
Four Oser-Selectable Display Formats to Suit the
Evaluation
Measurement results can be displayed in one of four display for-
mats: Graphics, list, matrix, or schmoo. After measurement has been
made and the results displayed, the softkeys can be used to access
various analysis functions for complete device evaluation. These
functions include MARKER for numeric readout of measured value
at any point along a plotted curve, CURSOR for numeric readout of
value at any graphic point and for line positioning, STORE/RE-
CALL for overlay comparisons, AUTO SCALE for optimum graphic
scaling, and LINE FUNCTION for direct readout of line gradient
and X-Y axis intercept values.

The HP4062UX Semiconductor Process Control System is the high-end system of the HP4062 Semiconductor Parametric Test System family. The HP4062UX satisfies all of the requirements of the Integrated Circuit Manufacturers for both process monitoring and process development. Since the HP4062UX uses the same mea¬surement hardware as the HP4062C, it maintains the same highly accurate and reliable measurement capabilities as the HP4062C, such as high-speed measurements over a wide measurement range. For example, a typical connect-connect-force-measure sequence (resistance) measurement takes less than 17 ms, and measurements can range from 20 fA to lA and 4 μV to 200V.
In addition to the sophisticated hardware of the HP4062C, the HP4062UX provides powerful software capabilities with the HP BASIC/UX operating environment. HP BASIC/UX combines the most powerful instrument control language. HP BASIC, with all the elements of HP-UX, the Hewlett-Packard implementation of the AT&T System V UNIX* operating system. HP Interactive Mea¬surement and Analysis (IMA) Software makes measurements inter¬actively by providing a softpanel user interface.

HP4062UX Process Control System Key Features:
 High-speed and wide measurement range
Standard networking
 Interactive Measurement and Analysis Software
Multiuser and multitasking
Multiwindowing
Offline debugger

HP4062UX Process Control System Specification：
Measurement functions:
I, V, I- V, C•G - V, C•G- t, Pulse I/V, Pulse I-V, Analog Search
Switching matrix – Number of pins (to I DUT):
12 pins to 48 pins (48-pin matrix)
24 pins to 96 pins (96-pin matrix)
Number of ports (to instrument): 9 ports (optionally 17) High-resolution source/monitor unit: 1 port
High-power source/ monitor unit: 1 port
Source/monitor units: 2 ports
Ground unit: 1 port optionally 10
Auxiliary: 4 ports
Maximum voltage at each port: ±200V (SMU ports
±100V (aux. ports)
Maximum current through port to pins: ±1.6A (GNDU port)
±1A (SMU port)

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AW Control Software
The AW Control Software provides a unique upgrade for RTP, Stripper, Etching and other systems which have won a high reputation among our customers.

The AW software Integrates all of the Process Control into a single reliable software package. It allows the user to control the entire machine from one single interface. The user can create recipes, run processes with the recipes, view and analyze process parameters, calibrate the entire system, and run diagnostics routines.

Features:
• GUI interface
• Real-Time process data acquisition
• Real-Time graphics
• Process Data Analysis
• Process Data and Recipe storage on a hard drive.
• Recipe Editor for Multi-step Processing
• System Calibration and Diagnostics
• Closed-loop System Controls

It has a Graphics User Interface (GUI) instead of the old Text based user interface. It is intuitive and easy to use with mouse or touch screen (optional).

The AW software Acquires Process Data in real-time. It then plots it in real-time on a graphics X-Y plot. So, what you see is what is actually happening. The process data is stored on a hard disk in real-time. This data can latter be retrieved and analyzed.

The blue line is the actual temperature. The black line is the recipe curve. The red line is the power changing for the heating source.

The AW software contains a Recipe Editor for creating and editing of multi-step process recipes. Recipes are created to automate the process of semiconductor wafers by telling the process control how to control each available parameter. It also allows the fine-tuning of certain parameters for specific applications.

It has comprehensive System Calibration and Diagnostics routines to automate many tasks and to help troubleshoot the system.

By maintaining real-time independent Closed-loop System Controls, the system optimizes vital device parameters

The AW Software upgrade uses a Pentium class computer, eliminating the old 80386 CPU, 6800 MPU, or the Z-80 MPU.
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Superior Temperature Control Technology
The software incorporates a Superior Temperature Control Technology that surpasses all original manufactures specs. The AW software is capable of controlling the temperature of the wafer to ± 1°C. It is also able to control the temperature from wafer-to-wafer to ± 0.5°C. This is possible with the built-in automated calibration routines and the upgraded 16 bit D/A card. First, the A/D circuits for the temperature feedback devices are calibrated. Then the pyrometer (optional on some systems) is calibrated. In order for the software to understand the thermal capacitance of the system, the chamber is also calibrated. These calibration routines allow the software to understand the complete system, taking into consideration the subtleties of the A/D circuits and the thermal capacitance of heating and cooling of the process chamber.

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Plasma Etch

Etching is used in microfabrication to chemically remove layers from the surface of a wafer during manufacturing. Etching is a critically important process module, and every wafer undergoes many etching steps before it is complete.
If the etch is intended to make a cavity in a material, the depth of the cavity may be controlled approximately using the etching time and the known etch rate. More often, though, etching must entirely
remove the top layer of a multilayer structure, without damaging the underlying or masking layers. The etching system's ability to do this depends on the ratio of etch rates in the two materials (selectivity).
Some etches undercut the masking layer and form cavities with sloping sidewalls. The distance of undercutting is called bias. Etchants with large bias are called isotropic.
Modern VLSI processes avoid wet etching, and use plasma etching instead. Plasma systems can operate in several modes by adjusting the parameters of the plasma. Ordinary plasma etching operates between 0.1 and 5 Torr. (This unit of pressure, commonly used in vacuum engineering, equals approximately 133.3 pascals) The plasma produces energetic free radicals, neutrally charged, that react at the surface of the wafer. Since neutral particles attack the wafer from all angles, this process is isotropic.
The source gas for the plasma usually contains small molecules rich in chlorine or fluorine. For instance, carbon tetrachloride (CCl4) etches silicon and aluminium, and trifluoromethane etches silicon dioxide and silicon nitride. A plasma containing oxygen is used to oxidize ("ash") photoresist and facilitate its removal.

Allwin21 Corp focuses on the following main Etcher equipments.
Matrix303
Matrix403
Gasonics AE2001
 Gasonics PEP3510
Tegal901e
Tegal903e
AW Control Software provides the unique upgrade system for Matrix, Gasonics, Tegal, Series. Advantage of upgraded system include:
Integrated process control system
Real time graphics display
Real time process data acquisition, display, and analysis
Programmed comprehensive calibration and diagnostic functions
Better performance and maintenance than the original systems
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We focus on the following tools.
Rapid Thermal Process/Annealing.
(1)Upgraded AG 210 (2)Upgraded AG 410 (3)Upgraded AG 610(AccuThermo AW 610).
(4)Upgraded AG 4100 (5)Upgraded AG 4100S (6)Upgraded AG 4108 (7)Upgraded AG 8108
(8)Upgraded AG 8800
Plasma Etch/Asher/Descum.
(1)Upgraded Matrix 105 (2)Upgraded Matrix 205 (3)Upgraded Matrix 303 (4)Upgraded Matrix 403
(5)Upgraded Tegal 901 (6)Upgraded Tegal 903 (7)Upgraded Tegal 901e(8)Upgraded Tegal 903e
(9)Upgraded Gasonics AE 2001 (10)Upgraded Gasonics Aura 1000 (11)Upgraded Gasonics Aura 3010
(12)Upgraded Gasonics PEP 3510 (13)Upgraded Branson IPC 3000
PECVD/RIE/ICP.
(1)STS 310 (2)STS 320 (3)Plasma Thermal 700 720 (4)Plasma Thermal 790
Probe/Tester.
(1)EG 1034 (2)EG 2001 (3)EG 2010 (4)HP 4062 (5)HP 4145B (6)HP 4142B (7)HP 4155
(8)HP 4084B (9)HP 4085B
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