6 layer rigid-lex PCB

Model: impedance control
Origin: China
Details: This board was manufactured for a high
volume telecommunications device, it
features a low cost lay-up with controlled
impedance on three layers.
Application: High volume telecommunications
Size: 1.5” by 0.5”
Layers: 6 overall, 2 flex
Materials: Adhesiveless flex
Epoxy no-flow prepreg
Traces: 4/6 innerlayers
8/6 outerlayers
Minimum hole: .0135
Minimum pad: .027
Thickness: .039 + .005
Other: Controlled impedance on 3 layers
Selective ENIG and fused solder