About us
MIS Co., Ltd is a Manufacturing Company producing Semiconductor tester machines.
MIS Co., Ltd is proud to introduce its MIS Auto Decaper machine.
As the devices are getting diverse and highly integrated, the necessity of defective analysis for the packaged semiconductor devices or other electrical raw material has been highly increased. Decapsulation is required to expose the internal components of a packaged device. MIS Auto Decaper machine removes automatically EMC(Epoxy Molding Compound) or plastic molding of any packaged semiconductor chip without melting solder bumps, overetching on metal bond pads, wire lifting, or destroying external leads.
It is also equipped with milling machine in order to permit precise and rapid chemical etching.
As soon as nitric and/or sulfuric acid is sprayed through a fine diameter nozzle head, heating process is followed soon in order to help better chemical reaction. Chemical fumes are exhausted by the strong ventilation systems so that user can be protected by chemical attacks.
All functions and operation are controlled by computer using GUI(Graphic User Interface).
Using Recipe files, user can easily decap the chip without trouble and error. After decapsulation of the chip, of course the device will remain still functional, various analysis can be accomplished.

User-friendly interface with GUI
- Computer GUI controls all the functions and operations.
- 0.01mm Milling Accuracy of the milling depth. Auto detection of the height using sensor.
- Various sizes of the chips ranged 1mm x 1mm ~ 50mm x 50mm can be decapped.
- Precise chemical injection control by 0.005ml(Min.)
Guarantee of repeatability
- Using the best recipe files stored in a database User can easily accomplish the test.
- User can also create new recipe and edit it.
- Protection from the acid gas evaporation using gas exhauster.
All in one system
Be able to expose most kinds of Packaged chips.
- Possible to decap various package types such as BGA, DIP, QFP, CSP & Flip Chip, etc.
Speedy process
- It requires less manual interruptions.
- Automatic and linear movements and speedy motions.
No Need of Gasket
- No need of gasket. It uses a jig, which can fix various kinds of the chips.

Industry FocusChemical MachineryPackaging Related MachinerySemiconductors
Business TypeManufacturer
Products/ServicesMIS Auto Decaper machine removes automatically EMC(Epoxy Molding Compound) or plastic molding of any packaged semiconductor chip.
Our MarketsEastern Asia
Year Established2004
Legal Representative(CEO)Kyeong Wook, Shin
Contact Information
Company NameMIS Co., LTD
Contact PersonMr Jeong James
Company AddressRoom 709, Daehyun Techno world, 174 Ojeon-Dong, Uiwang Si, Gyeonggi-do, South Korea
Postal Code437-820
Telephone Number82 31 4598088
Mobile Number82-10-7774-8299
Fax Number82 31 4596088
WebsiteMIS Co., LTD, http://mis.ne.kr, http://www.bizearch.com/company/MIS_Co_LTD_73948.htm
Contact Supplier / Manufacturer

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