In-Mat Technologies (Singapore) Pte. Ltd.
| About us | o Die-Attach Epoxies Conductive & Non-Conductive epoxies for attaching IC chip to leadframes or flex/rigid substrates o Optical Epoxies Clear & transparent epoxies for potting or casting of LEDs or electronic components o Structural Epoxies High temperature epoxies for potting of electronic components or bonding of various substrates such as metal, plastic, ceramic & glass etc. o Liquid Encapsulant Encapsulation epoxies for protecting IC chip & bonding wires using the Globtop or Dam & Fill method o Underfill No-Flow underfill for Flip-Chip attach In addition to the above product lines, In-Mat also welcomes any enquiries requiring product customisation. In-Mat strives to be your preferred material supplier in offering good quality & cost competitive products, so that our customers can better compete to be the best manufacturer in terms of cost & quality. Last but not least, we at In-Mat sincerely look forward to supporting & servicing you on your material needs. |
|---|---|
| Industry Focus | Adhesives & Sealants |
| Business Type | Manufacturer |
| Products/Services | Die-attach epoxies(conductivenon-conductive), optical epoxies, structural epoxies, liquid encapsulant (globtopdam & fill), underfill |
| Our Markets | Southeast Asia |
| No. of Employees | 5 - 10 People |
